Advanced packaging (3D and chiplets)

Which industry-standard die-to-die interface aims to let chiplets from different companies connect to each other?

  1. AHDMI
  2. BUCIe
  3. CBluetooth
Show answer and explanation

Answer: B. UCIe

UCIe (Universal Chiplet Interconnect Express) is a standard for connecting chiplets within a package. A common standard makes it easier to combine chiplets made by different companies and on different processes, and is expected to broaden the use of chiplets.

Practice this topic Back to topic

More Advanced packaging (3D and chiplets) questions

  1. Which is especially likely to be a challenge in 3D packaging, which stacks chips vertically?
  2. Which correctly describes SiP (system in package)?
  3. In flip-chip connections, what is the main advantage of using copper pillars (Cu pillars) instead of solder balls?
  4. What is the wiring layer called that is formed on a chip or wafer surface to route electrode positions to the positions of external terminals?
  5. Which approach, instead of a large silicon interposer, embeds small pieces of silicon only at the chip-to-chip connection areas to achieve high-density wiring?