Advanced packaging (3D and chiplets)

Which correctly describes hybrid bonding?

  1. AA technology that enlarges solder bumps to improve connection reliability
  2. BA technology that connects using two wires at a time
  3. CA technology that directly bonds surfaces of copper electrodes and dielectric without bumps, enabling extremely dense connections
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Answer: C. A technology that directly bonds surfaces of copper electrodes and dielectric without bumps, enabling extremely dense connections

Hybrid bonding planarizes chip or wafer surfaces and directly bonds copper electrodes to each other and dielectric to dielectric at the same time. Because no solder bumps are used, connection pitch can be reduced to a few µm, and it is used in stacked image sensors and advanced chip stacking.

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More Advanced packaging (3D and chiplets) questions

  1. Which correctly describes a feature of fan-out wafer-level packaging (FOWLP)?
  2. Which industry-standard die-to-die interface aims to let chiplets from different companies connect to each other?
  3. Which is especially likely to be a challenge in 3D packaging, which stacks chips vertically?
  4. Which correctly describes SiP (system in package)?
  5. In flip-chip connections, what is the main advantage of using copper pillars (Cu pillars) instead of solder balls?