Advanced packaging (3D and chiplets)

Which correctly describes a feature of fan-out wafer-level packaging (FOWLP)?

  1. ARedistribution layers extend beyond the chip edges, so external terminals can be placed over an area larger than the chip
  2. BConnections are made only by wire bonding
  3. CThe package is always smaller than the chip
Show answer and explanation

Answer: A. Redistribution layers extend beyond the chip edges, so external terminals can be placed over an area larger than the chip

In FOWLP, singulated chips are embedded in resin to form a reconstituted wafer, and redistribution layers extending beyond the chip edges are formed on it. It is thin without a substrate and can place many terminals, so it has been adopted for smartphone processors and similar devices.

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More Advanced packaging (3D and chiplets) questions

  1. Which industry-standard die-to-die interface aims to let chiplets from different companies connect to each other?
  2. Which is especially likely to be a challenge in 3D packaging, which stacks chips vertically?
  3. Which correctly describes SiP (system in package)?
  4. In flip-chip connections, what is the main advantage of using copper pillars (Cu pillars) instead of solder balls?
  5. What is the wiring layer called that is formed on a chip or wafer surface to route electrode positions to the positions of external terminals?