Advanced packaging (3D and chiplets)

What are the bumps called, far smaller than ordinary solder balls, used to connect chips stacked with TSVs and to connect chips to interposers?

  1. AMicrobumps
  2. BBGA solder balls
  3. CLeads
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Answer: A. Microbumps

Microbumps are very small bumps arranged at pitches of a few tens of µm, used for the many connections between chips. They are used to stack HBM DRAM dies and to connect chips on interposers. When an even finer pitch is needed, hybrid bonding is used.

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More Advanced packaging (3D and chiplets) questions

  1. In AI GPUs, what is the main reason the GPU chip and HBM are placed side by side on one silicon interposer?
  2. In 3D NAND, which is a correct advantage of making the memory cell array and peripheral circuits on separate wafers and bonding them together?
  3. What is the material called that is placed between a chip and a heat spreader to fill microscopic gaps and improve heat transfer?
  4. What is the data transfer capacity that can be secured per unit length of chip edge called, emphasized as a performance metric for chiplet interconnects?
  5. Which correctly describes the difference between 2.5D and 3D packaging?