Advanced packaging (3D and chiplets)

What is the material called that is placed between a chip and a heat spreader to fill microscopic gaps and improve heat transfer?

  1. ATIM (thermal interface material)
  2. BUnderfill
  3. CMold resin
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Answer: A. TIM (thermal interface material)

Even when solids are stacked together, microscopic surface roughness leaves gaps that make heat hard to transfer. A TIM (Thermal Interface Material) fills these gaps to improve heat transfer; types include greases, sheets and metal-based materials. It is an important component for high-power processors.

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More Advanced packaging (3D and chiplets) questions

  1. What is the data transfer capacity that can be secured per unit length of chip edge called, emphasized as a performance metric for chiplet interconnects?
  2. Which correctly describes the difference between 2.5D and 3D packaging?
  3. In HBM, what is the typical number of DRAM dies stacked in one stack?
  4. What is the concept called that integrates chips made with different manufacturing processes and materials into one package?
  5. Which correctly describes the typical TSV formation process?