Advanced packaging (3D and chiplets)

Among hybrid bonding methods, which allows only chips judged good in test to be selected and bonded to the target wafer?

  1. AWafer-to-wafer (W2W) bonding
  2. BChip-to-wafer (C2W) bonding
  3. CWire bonding
Show answer and explanation

Answer: B. Chip-to-wafer (C2W) bonding

W2W bonding bonds entire wafers at once and is efficient, but defective chips get bonded to each other, and good chips to defective ones. C2W bonding can select and bond only good singulated chips, giving a yield advantage, and chips of different sizes can be combined.

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More Advanced packaging (3D and chiplets) questions

  1. What are the bumps called, far smaller than ordinary solder balls, used to connect chips stacked with TSVs and to connect chips to interposers?
  2. In AI GPUs, what is the main reason the GPU chip and HBM are placed side by side on one silicon interposer?
  3. In 3D NAND, which is a correct advantage of making the memory cell array and peripheral circuits on separate wafers and bonding them together?
  4. What is the material called that is placed between a chip and a heat spreader to fill microscopic gaps and improve heat transfer?
  5. What is the data transfer capacity that can be secured per unit length of chip edge called, emphasized as a performance metric for chiplet interconnects?