Advanced packaging (3D and chiplets)

What is the data transfer capacity that can be secured per unit length of chip edge called, emphasized as a performance metric for chiplet interconnects?

  1. AFIT
  2. BBandwidth density (transfer rate per unit length of chip edge)
  3. CProcess capability index
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Answer: B. Bandwidth density (transfer rate per unit length of chip edge)

Chiplets are usually connected through terminals arranged along their edges, so how much data can be transferred per 1 mm of edge length (bandwidth density) is an important metric. The energy needed to send one bit is also emphasized.

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More Advanced packaging (3D and chiplets) questions

  1. Which correctly describes the difference between 2.5D and 3D packaging?
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  3. What is the concept called that integrates chips made with different manufacturing processes and materials into one package?
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  5. What is the main aim of manufacturing packages all at once on large rectangular panels instead of round wafers?