What is BGA?
Ball grid array. A high-pin-count package with solder balls arranged in a grid on its underside.
Field: Packaging and assembly
BGA in the explanations
A BGA uses solder balls arranged in a grid over the whole bottom of the package as external terminals.
Which correctly describes a feature of BGA (ball grid array…A QFP has leads on all four sides, and a BGA has solder balls on its bottom.
Which surface-mount package has gull-wing leads coming out …Arranging terminals in a grid on the bottom is the same as in a BGA.
Which package has flat electrodes (lands) arranged in a gri…
Questions that mention BGA (5)
- Which correctly describes a feature of BGA (ball grid array) packages?
- In high-pin-count BGA packages, why are many of the balls assigned to power and ground?
- Which surface-mount package has gull-wing leads coming out of two sides?
- Which package has flat electrodes (lands) arranged in a grid on its bottom instead of solder balls?
- Which method is used to observe solder joint voids and wire shapes inside a package in three dimensions without destroying it?
Related terms
Backgrinding CSP (chip-scale package) Dicing Die bonding Flip chip Lead frame Reflow soldering Thermal resistance Underfill Wire bonding