Advanced packaging (3D and chiplets)
Which correctly describes chiplets?
- AA technology that connects several small chips, divided by function, inside one package so they operate as one system
- BA technology that uses an entire wafer as a single chip
- CA technology that solders chips directly to the board without a package
Show answer and explanation
Answer: A. A technology that connects several small chips, divided by function, inside one package so they operate as one system
Instead of putting every function on one large chip, the chiplet approach makes the compute section, I/O section and so on as separate small chips and connects them at high density inside a package. Small chips have high yield, and the best manufacturing process can be chosen for each function.