What is Underfill?

Resin filled into the gap between the chip and the substrate in flip-chip assembly. It spreads out stress from thermal expansion mismatch and protects the bump joints.

Field: Packaging and assembly

Underfill in the explanations

Filling the gap with underfill resin distributes the stress and greatly extends connection life.
In flip-chip mounting, what is the main purpose of filling …

Questions that mention Underfill (1)

In flip-chip mounting, what is the main purpose of filling the gap between chip and substrate with underfill resin?

Related terms

Backgrinding BGA CSP (chip-scale package) Dicing Die bonding Flip chip Lead frame Reflow soldering Thermal resistance Wire bonding

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