Packaging and assembly

Which correctly describes a CSP (chip-scale package)?

  1. AA large package with several chips placed side by side
  2. BA package shrunk to nearly the same size as the chip
  3. CA flat package with leads on all four sides
Show answer and explanation

Answer: B. A package shrunk to nearly the same size as the chip

CSP is a general term for packages made nearly the same size as the chip (generally no more than about 1.2 times the chip size). They are widely used in products such as mobile devices where mounting area must be kept small.

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More Packaging and assembly questions

  1. Which correctly describes a feature of wafer-level packaging (WLP)?
  2. In flip-chip mounting, what is the main purpose of filling the gap between chip and substrate with underfill resin?
  3. Which composition is widely used as lead-free solder to meet environmental regulations?
  4. Which correctly describes a feature of QFN (Quad Flat No-lead) packages?
  5. What is the step called that attaches and fixes the chip at a set position on a lead frame or substrate?