Packaging and assembly

Which package has flat electrodes (lands) arranged in a grid on its bottom instead of solder balls?

  1. ASOP
  2. BLGA (land grid array)
  3. CDIP
Show answer and explanation

Answer: B. LGA (land grid array)

An LGA has flat lands arranged in a grid on its bottom. Without solder balls, its mounted height is lower, and in processors it is also used with sockets whose spring pins make contact. Arranging terminals in a grid on the bottom is the same as in a BGA.

  • A. An SOP is a surface-mount package with leads on two sides.
  • B. Correct. It has flat lands arranged in a grid.
  • C. A DIP has pins on two sides inserted into board holes.
Practice this topic Back to topic

More Packaging and assembly questions

  1. What material is most widely used as the base material of printed circuit boards in electronics?
  2. Why are the molding compounds of many plastic packages black?
  3. In high-pin-count BGA packages, why are many of the balls assigned to power and ground?
  4. In wire bonding that forms a ball, where is the first bond (ball bond) generally made?
  5. What is the main purpose of heating packages in an oven for some time after molding (post-mold cure)?