BGA vs QFP vs QFN: IC Package Types Compared

These are three common surface-mount IC packages that differ in where the connections are. A QFP has gull-wing leads sticking out of all four sides. A QFN has flat pads on the underside edges with no leads. A BGA has a grid of solder balls across the whole underside. BGAs give the most connections in the smallest area, QFNs are compact with excellent heat dissipation, and QFPs are the easiest to inspect and solder by hand.

AspectBGAQFPQFN
TerminalsA grid of solder balls on the bottomGull-wing leads on all four sidesFlat pads on the bottom edges, plus an exposed thermal pad in the center
Typical pin countHundreds to thousandsAbout 32 to 300About 8 to 100
Typical pitchAbout 0.4 to 1.27 mmAbout 0.4 to 0.8 mmAbout 0.4 to 0.65 mm
SizeCompact for the pin countLargest: the leads extend beyond the bodySmall and thin
Electrical performanceShort paths, low inductanceLonger leads, higher inductanceShort paths, low inductance
Heat dissipationGood, through the balls and thermal viasModerateExcellent, through the exposed pad
Inspection and reworkJoints are hidden, so X-ray inspection is needed and rework is hardEasy: leads are visible and can be hand-solderedHarder: joints are partly hidden under the package
Narrow pitch problemNeeds fine vias and many board layersLeads can bend or bridge when the pitch is very narrowModerate
Typical usesCPUs, GPUs, FPGAs, SoCs and memoriesMicrocontrollers and older ASICsMicrocontrollers, RF, power management and sensors

Figures are typical orders of magnitude and vary by process generation and product.

When to use which

BGA
When you need a lot of pins in a small area with good electrical performance, as in processors and memories.
QFP
When ease of assembly, inspection and prototyping matter more than size.
QFN
When you need a small, thin package with good heat dissipation and moderate pin count.

FAQ

Why is BGA used for CPUs?

A BGA places a grid of solder balls across the whole underside, giving hundreds to thousands of connections in a small area, with short, low-inductance paths.

Is QFN easier to solder than BGA?

Generally yes, but QFN is harder than QFP because its joints are partly hidden under the package. BGA joints are completely hidden and need X-ray inspection.

What is the exposed pad on a QFN?

A metal pad in the center of the underside that is soldered to the board to carry heat away, and it often serves as the ground connection.

Which package is best for hand soldering?

QFP, because its leads are visible and easy to reach.

Check your understanding

Which correctly describes a feature of BGA (ball grid array) packages?

  1. ALeads come out of two sides of the package
  2. BGull-wing leads come out of all four sides of the package
  3. CSolder balls are arranged in a grid on the bottom of the package
Show answer and explanation

Answer: C. Solder balls are arranged in a grid on the bottom of the package

A BGA uses an array of solder balls across the entire underside as external terminals. Using the area rather than just the perimeter allows more terminals than a QFP of the same size, with shorter connections. Because the joints are hidden underneath and cannot be inspected visually, X-ray inspection is used. Leads on two sides describe an SOP, and gull-wing leads on four sides describe a QFP.

Which correctly describes a feature of QFN (Quad Flat No-lead) packages?

  1. ALong leads extend outward from all four sides of the package
  2. BA small package with no protruding leads, with electrodes on the four edges of its bottom
  3. CSolder balls are arranged in a grid over the entire bottom
Show answer and explanation

Answer: B. A small package with no protruding leads, with electrodes on the four edges of its bottom

A QFN has no leads protruding from its sides; electrodes are exposed around the perimeter of the bottom. The short leads give low inductance and allow small, thin packages. A large thermal pad in the center is soldered to the board, and heat escapes through board vias, giving good thermal performance. The hidden joints make visual inspection difficult, however. Long leads on four sides describe a QFP, and a ball array describes a BGA.

Which surface-mount package has gull-wing leads coming out of two sides?

  1. ASOP
  2. BQFP
  3. CBGA
Show answer and explanation

Answer: A. SOP

An SOP (Small Outline Package) is a surface-mount package with leads bent outward like gull wings along its two long sides. The visible lead tips make solder joints easy to inspect, and it is widely used for low-pin-count ICs. The thinner TSOP has long been used for memory. Leads on four sides describe a QFP, and balls on the bottom describe a BGA.

  1. In high-pin-count QFPs, which problem tends to occur if the lead pitch is made too narrow?
  2. For surface-mount packages, which moisture-related rating specifies, among other things, how long they may be left after opening the moisture-proof packing before reflow?
  3. Which correctly describes a CSP (chip-scale package)?

Practice Packaging and assembly questions

Key terms explained

BGA
Ball grid array. A high-pin-count package with solder balls arranged in a grid on its underside.
CSP (chip-scale package)
A general term for packages shrunk to nearly the size of the chip. They are widely used in compact devices such as smartphones.

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