A package in which redistribution wiring and external terminals are formed while the chips are still in wafer form, before dicing. The result is a small package about the size of the chip.
Field: Packaging and assembly
In WLP, redistribution layers and external terminals such as solder balls are formed all at once on the wafer before dicing, and the wafer is finally cut into individual chips.
Which correctly describes a feature of wafer-level packagin…Dicing Backgrinding BGA CSP (chip-scale package) Die bonding Flip chip Lead frame Reflow soldering Thermal resistance Underfill