What is CSP (chip-scale package)?
A general term for packages shrunk to nearly the size of the chip. They are widely used in compact devices such as smartphones.
Field: Packaging and assembly
A general term for packages shrunk to nearly the size of the chip. They are widely used in compact devices such as smartphones.
Field: Packaging and assembly
CSP is a general term for packages made nearly the same size as the chip (generally no more than about 1.2 times the chip size).
Which correctly describes a CSP (chip-scale package)?Backgrinding BGA Dicing Die bonding Flip chip Lead frame Reflow soldering Thermal resistance Underfill Wire bonding