Packaging and assembly

Which correctly describes a feature of BGA (ball grid array) packages?

  1. ALeads come out of two sides of the package
  2. BGull-wing leads come out of all four sides of the package
  3. CSolder balls are arranged in a grid on the bottom of the package
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Answer: C. Solder balls are arranged in a grid on the bottom of the package

A BGA uses solder balls arranged in a grid over the whole bottom of the package as external terminals. Because terminals are taken from an area, more terminals can be placed than in packages such as QFPs that bring leads out around the edges. Leads from two sides are found in SOPs, and gull-wing leads from four sides in QFPs.

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More Packaging and assembly questions

  1. Which correctly describes dicing?
  2. Which material is mainly used as the encapsulant in typical resin-molded packages?
  3. Which materials are commonly used for lead frames?
  4. Which correctly describes a CSP (chip-scale package)?
  5. Which correctly describes a feature of wafer-level packaging (WLP)?