Reliability

For mobile devices such as smartphones, which test is especially emphasized in evaluating solder joint reliability?

  1. AHTOL (high temperature operating life test)
  2. BIDDQ test
  3. CDrop impact test
Show answer and explanation

Answer: C. Drop impact test

When a mobile device is dropped, the impact flexes the board and can crack solder joints of BGAs and similar parts. Drop impact tests, which repeatedly apply drop shocks to boards with mounted parts and evaluate joint fracture, are therefore emphasized.

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More Reliability questions

  1. Which failure can occur when electromigration creates a hillock on a wire?
  2. Which reliability test condition is appropriate for statistically guaranteeing a very low failure rate?
  3. In thin gate oxides, what is the mild breakdown called in which leakage current increases in steps before insulation is completely lost?
  4. Which pair correctly names "failures in which function is suddenly and completely lost" and "failures in which characteristics gradually drift out of specification"?
  5. For typical consumer semiconductor products, which is closest to the usage period commonly assumed in reliability design?