Advanced packaging (3D and chiplets)

Which TSMC fan-out wafer-level packaging technology became widely known when it was adopted for a smartphone processor in 2016?

  1. AInFO (Integrated Fan-Out)
  2. BCoWoS
  3. CHBM
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Answer: A. InFO (Integrated Fan-Out)

InFO is a fan-out packaging technology that forms redistribution layers on a reconstituted wafer with chips embedded in resin, making packages thin and small without a package substrate. Its adoption in 2016 for Apple's smartphone processors triggered the widespread use of fan-out advanced packaging.

  • A. Correct. It is TSMC's fan-out packaging technology.
  • B. CoWoS is a 2.5D packaging technology using a silicon interposer.
  • C. HBM is stacked memory.
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More Advanced packaging (3D and chiplets) questions

  1. Which is a challenge of wafer-on-wafer (W2W) bonding, which bonds entire wafers together?
  2. In 2.5D packaging, what is the main advantage of using an interposer made of redistribution layers (RDL) of organic dielectric and copper wiring instead of a silicon interposer?
  3. Through the HBM3 generation, which is the data bus width per HBM stack?
  4. When a TSV wafer is thinned to tens of micrometers and processed, which technique temporarily attaches it to a support wafer (carrier) to prevent cracking and warpage?
  5. In fan-out wafer-level packaging, what is the wafer-like form called that is rebuilt by placing diced chips with spacing on a support and embedding them in resin?