Advanced packaging (3D and chiplets)

In fan-out wafer-level packaging, what is the wafer-like form called that is rebuilt by placing diced chips with spacing on a support and embedding them in resin?

  1. ASOI wafer
  2. BEpitaxial wafer
  3. CReconstituted wafer
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Answer: C. Reconstituted wafer

In fan-out packaging, good chips are placed with spacing between them and surrounded with mold resin to rebuild a wafer shape, called a reconstituted wafer. Because redistribution layers can be formed on the resin extending beyond each chip, external terminals can be placed over an area larger than the chip.

  • A. An SOI wafer has a thin silicon layer on an insulating film.
  • B. An epitaxial wafer has a single-crystal layer grown on its surface.
  • C. Correct. It is a wafer rebuilt by embedding chips in resin.
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More Advanced packaging (3D and chiplets) questions

  1. Which is a challenge of moving to chiplets?
  2. What is the main aim of products that stack a cache SRAM chip on top of a processor chip with hybrid bonding?
  3. Which method is used to make silicon interposers larger than the maximum area a lithography tool can expose at once (about 26 mm × 33 mm)?
  4. Which correctly explains how copper electrodes are joined to each other in copper-dielectric hybrid bonding?
  5. In classifying TSVs by when they are formed, which approach makes TSVs after forming transistors but before forming the multilayer interconnect?