Advanced packaging (3D and chiplets)

When a TSV wafer is thinned to tens of micrometers and processed, which technique temporarily attaches it to a support wafer (carrier) to prevent cracking and warpage?

  1. AWire bonding
  2. BTemporary bonding and debonding
  3. CReflow
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Answer: B. Temporary bonding and debonding

A wafer thinned to tens of micrometers cracks easily on its own and warps significantly. It is therefore temporarily attached to a glass or silicon support wafer with adhesive or the like (temporary bonding), backside grinding and wiring are carried out, and it is then released by laser, heat or other means (debonding). It is an important technique for handling thin wafers safely.

  • A. Wire bonding connects a chip to terminals with fine metal wires.
  • B. Correct. The wafer is handled while temporarily attached to a support wafer.
  • C. Reflow is the step of melting solder to make joints.
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More Advanced packaging (3D and chiplets) questions

  1. In fan-out wafer-level packaging, what is the wafer-like form called that is rebuilt by placing diced chips with spacing on a support and embedding them in resin?
  2. Which is a challenge of moving to chiplets?
  3. What is the main aim of products that stack a cache SRAM chip on top of a processor chip with hybrid bonding?
  4. Which method is used to make silicon interposers larger than the maximum area a lithography tool can expose at once (about 26 mm × 33 mm)?
  5. Which correctly explains how copper electrodes are joined to each other in copper-dielectric hybrid bonding?