Advanced packaging (3D and chiplets)

Which correctly describes the role of the base die (logic die) at the bottom of an HBM stack?

  1. AIt handles the interface between the stacked DRAM and the processor, as well as functions such as test
  2. BIt is placed as decoration
  3. CIt emits light
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Answer: A. It handles the interface between the stacked DRAM and the processor, as well as functions such as test

The HBM base die handles signal exchange between the stacked DRAM dies and the processor and also includes circuits for test and repair. Recently there has also been a move to make the base die with a logic process and give it more functions.

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More Advanced packaging (3D and chiplets) questions

  1. For high-power AI packages, which is a correct example of cooling methods being considered and introduced?
  2. Which is a basic advantage of 3D packaging, which stacks chips vertically?
  3. What is the problem called in which the speed of supplying data from memory cannot keep up with improvements in processor compute performance, limiting overall performance?
  4. Which stacking method, long used in smartphone memory and elsewhere, stacks multiple chips slightly offset from one another and connects each to the substrate with wire bonding?
  5. In contrast to chiplets, what is the conventional approach called in which all the functions a system needs are built into one large chip?