Advanced packaging (3D and chiplets)

For high-power AI packages, which is a correct example of cooling methods being considered and introduced?

  1. ADo nothing and wait for natural cooling
  2. BCover the package with insulation
  3. CLiquid cooling, such as flowing liquid through cold plates or immersion cooling
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Answer: C. Liquid cooling, such as flowing liquid through cold plates or immersion cooling

AI GPUs and similar devices consume from several hundred W to more than 1 kW per package, so air cooling can no longer remove all the heat. Methods such as flowing coolant through cold plates and immersion cooling, which submerges entire servers in dielectric liquid, are being introduced.

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More Advanced packaging (3D and chiplets) questions

  1. Which is a basic advantage of 3D packaging, which stacks chips vertically?
  2. What is the problem called in which the speed of supplying data from memory cannot keep up with improvements in processor compute performance, limiting overall performance?
  3. Which stacking method, long used in smartphone memory and elsewhere, stacks multiple chips slightly offset from one another and connects each to the substrate with wire bonding?
  4. In contrast to chiplets, what is the conventional approach called in which all the functions a system needs are built into one large chip?
  5. Advanced packaging steps that use front-end-like fine processing at the wafer level, such as forming TSVs and fine redistribution layers, sit between the front end and back end. What are they called?