Advanced packaging (3D and chiplets)

Which correctly describes the conditions required of the surfaces to be joined in hybrid bonding?

  1. AThe surfaces should be roughened
  2. BVery high flatness and cleanliness at the nanometer level
  3. CA thick oil film on the surface
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Answer: B. Very high flatness and cleanliness at the nanometer level

Because hybrid bonding directly joins surfaces of copper electrodes and dielectric without bumps, the bonding surfaces must be flat at the nanometer level and free of particles and contamination. Even a tiny particle can cause unbonded cavities (voids). CMP and cleaning technologies are important.

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More Advanced packaging (3D and chiplets) questions

  1. Which correctly describes the role of the base die (logic die) at the bottom of an HBM stack?
  2. For high-power AI packages, which is a correct example of cooling methods being considered and introduced?
  3. Which is a basic advantage of 3D packaging, which stacks chips vertically?
  4. What is the problem called in which the speed of supplying data from memory cannot keep up with improvements in processor compute performance, limiting overall performance?
  5. Which stacking method, long used in smartphone memory and elsewhere, stacks multiple chips slightly offset from one another and connects each to the substrate with wire bonding?