Advanced packaging (3D and chiplets)

In contrast to chiplets, what is the conventional approach called in which all the functions a system needs are built into one large chip?

  1. ADiscrete
  2. BMonolithic
  3. CHybrid
Show answer and explanation

Answer: B. Monolithic

Monolithic means "a single block of stone": all functions are built on one silicon chip. On-chip wiring connects everything, an advantage for performance and power, but yield falls as chips grow larger, and there is also a limit on the maximum area that can be exposed. Chiplets that split functions apart came into use for these reasons.

  • A. Discrete refers to products such as single transistors and diodes.
  • B. Correct. It builds everything into one chip.
  • C. Hybrid is a general word for combining different things.
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More Advanced packaging (3D and chiplets) questions

  1. Advanced packaging steps that use front-end-like fine processing at the wafer level, such as forming TSVs and fine redistribution layers, sit between the front end and back end. What are they called?
  2. Which TSMC 2.5D packaging technology is widely used to place AI GPUs and HBM side by side on a silicon interposer and connect them?
  3. Which TSMC fan-out wafer-level packaging technology became widely known when it was adopted for a smartphone processor in 2016?
  4. Which is a challenge of wafer-on-wafer (W2W) bonding, which bonds entire wafers together?
  5. In 2.5D packaging, what is the main advantage of using an interposer made of redistribution layers (RDL) of organic dielectric and copper wiring instead of a silicon interposer?