Advanced packaging (3D and chiplets)

Which correctly describes the benefits expected from using chiplets?

  1. AThey always become cheaper and faster in every case
  2. BDesign becomes entirely unnecessary
  3. CThe best process can be chosen for each function, small chips raise yield, and designs are easier to reuse
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Answer: C. The best process can be chosen for each function, small chips raise yield, and designs are easier to reuse

With chiplets, the best process can be chosen for each function — for example, an advanced process for parts that need high performance and a mature process for I/O and analog. Small chips have high yield, and the same chiplet can be reused in multiple products. On the other hand, chip-to-chip interconnect and packaging costs are added.

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More Advanced packaging (3D and chiplets) questions

  1. Which correctly describes the conditions required of the surfaces to be joined in hybrid bonding?
  2. Which correctly describes the role of the base die (logic die) at the bottom of an HBM stack?
  3. For high-power AI packages, which is a correct example of cooling methods being considered and introduced?
  4. Which is a basic advantage of 3D packaging, which stacks chips vertically?
  5. What is the problem called in which the speed of supplying data from memory cannot keep up with improvements in processor compute performance, limiting overall performance?