Advanced packaging (3D and chiplets)

What is the main aim of manufacturing packages all at once on large rectangular panels instead of round wafers?

  1. ATo increase the number processed at once and improve area utilization, lowering cost
  2. BTo make packages larger
  3. CTo make packages more expensive
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Answer: A. To increase the number processed at once and improve area utilization, lowering cost

Rectangular panels can hold square packages with less waste than round wafers and are easier to scale up, so many packages can be processed at once. Panel-level packaging is being developed as a way to lower costs, for fan-out packages and others.

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