Advanced packaging (3D and chiplets)

What is the concept called that integrates chips made with different manufacturing processes and materials into one package?

  1. AMonolithic integration
  2. BHeterogeneous integration
  3. CDiscrete mounting
Show answer and explanation

Answer: B. Heterogeneous integration

Heterogeneous integration uses advanced packaging to integrate chips made with different processes and materials — advanced-process logic, DRAM, analog, RF, photonic devices and more — into one system. It is attracting attention as a way to overcome the limits of monolithic integration, which builds everything on one chip.

Practice this topic Back to topic

More Advanced packaging (3D and chiplets) questions

  1. Which correctly describes the typical TSV formation process?
  2. What is the main aim of manufacturing packages all at once on large rectangular panels instead of round wafers?
  3. To stack chips with TSVs, approximately how thin are wafers ground from the back?
  4. Which correctly describes the benefits expected from using chiplets?
  5. Which correctly describes the conditions required of the surfaces to be joined in hybrid bonding?