Advanced packaging (3D and chiplets)

To stack chips with TSVs, approximately how thin are wafers ground from the back?

  1. AA few tens of µm
  2. BA few mm
  3. CA few cm
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Answer: A. A few tens of µm

Chips stacked with TSVs are thinned to a few tens of µm to keep hole depth down and reduce the total thickness after stacking. Thin wafers crack and warp easily, so techniques such as temporarily bonding them to a carrier substrate for processing are used.

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