Tiny defects formed inside a CZ silicon wafer when its oxygen precipitates during heat treatment. Also called BMDs (bulk micro defects), they serve as gettering sites that capture metal impurities.
Field: Silicon wafers
Intrinsic gettering uses oxygen precipitates in the wafer bulk; extrinsic gettering uses backside damage or polysilicon films.
Which correctly describes gettering?BMD density is controlled to about 10⁸–10¹⁰ cm⁻³.
What is the purpose of using bulk microdefects (BMDs), form…Adding trace nitrogen (about 10¹³–10¹⁵ cm⁻³) promotes nucleation of oxygen precipitates, boosting gettering, and shrinks vacancy-cluster voids (COPs) so later anneals can dissolve them.
Which is a known effect of adding a trace of nitrogen durin…Gettering Czochralski (CZ) method Donor CMOS Latch-up Thermal oxidation Crystal orientation DZ (denuded zone) FZ method (float zone) Ingot