Packaging and assembly

Which materials are commonly used for lead frames?

  1. ACopper alloys and iron-nickel alloy (Alloy 42)
  2. BGlass
  3. CEpoxy resin
Show answer and explanation

Answer: A. Copper alloys and iron-nickel alloy (Alloy 42)

A lead frame is a metal frame on which the chip is mounted and which also serves as the external terminals. Copper alloys, with excellent electrical and thermal conductivity, and iron-nickel alloy (Alloy 42), whose thermal expansion is close to silicon's, are used. The surface is plated to improve solderability.

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More Packaging and assembly questions

  1. Which correctly describes a CSP (chip-scale package)?
  2. Which correctly describes a feature of wafer-level packaging (WLP)?
  3. In flip-chip mounting, what is the main purpose of filling the gap between chip and substrate with underfill resin?
  4. Which composition is widely used as lead-free solder to meet environmental regulations?
  5. Which correctly describes a feature of QFN (Quad Flat No-lead) packages?