Packaging and assembly

Which material is mainly used as the encapsulant in typical resin-molded packages?

  1. APure copper
  2. BEpoxy resin
  3. CSingle-crystal silicon
Show answer and explanation

Answer: B. Epoxy resin

In resin-molded packages, epoxy resin containing fillers such as silica is injected into a mold to encapsulate the chip (transfer molding). It protects the chip from moisture and shock, and the amount of filler is adjusted to bring its coefficient of thermal expansion closer to that of the chip and substrate.

Practice this topic Back to topic

More Packaging and assembly questions

  1. Which materials are commonly used for lead frames?
  2. Which correctly describes a CSP (chip-scale package)?
  3. Which correctly describes a feature of wafer-level packaging (WLP)?
  4. In flip-chip mounting, what is the main purpose of filling the gap between chip and substrate with underfill resin?
  5. Which composition is widely used as lead-free solder to meet environmental regulations?