Packaging and assembly
Which correctly describes a feature of wafer-level packaging (WLP)?
- AChips are cut out one by one before the package is assembled
- BChips are shaped by melting them in resin
- CRedistribution and external terminals are formed while still in wafer form, and the wafer is then singulated
Show answer and explanation
Answer: C. Redistribution and external terminals are formed while still in wafer form, and the wafer is then singulated
In WLP, redistribution layers and external terminals such as solder balls are formed all at once on the wafer before dicing, and the wafer is finally cut into individual chips. Because the steps are done per wafer, it is efficient and yields a package the same size as the chip.