Packaging and assembly

Which correctly describes flip-chip mounting?

  1. AA method that ships chips without encapsulating them in resin
  2. BA method that places the chip circuit side down and connects it directly to the substrate with bumps
  3. CA method that mounts the chip standing vertically on the substrate
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Answer: B. A method that places the chip circuit side down and connects it directly to the substrate with bumps

In flip-chip mounting, the chip is turned upside down and connected to the substrate through bumps (solder, copper pillars, etc.) formed on its circuit side. The connections are shorter than wires, giving better electrical characteristics, and terminals can be placed over the whole chip area, making it suitable for high pin counts.

Wire bonding and flip chip Package substrate Circuit side up Wire bonding Package substrate Circuit side down, joined by bumps Flip chip Underfill
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More Packaging and assembly questions

  1. Which correctly describes a feature of BGA (ball grid array) packages?
  2. Which correctly describes dicing?
  3. Which material is mainly used as the encapsulant in typical resin-molded packages?
  4. Which materials are commonly used for lead frames?
  5. Which correctly describes a CSP (chip-scale package)?