In manufacturing fan-out wafer-level packages, what is the problem called in which chips shift position because of resin flow or shrinkage during curing when they are encapsulated?

Answer: C. Die shift

When making a reconstituted wafer, flow of the mold resin and shrinkage during curing and cooling can shift the placed chips slightly. This is called die shift. Large shifts misalign the chip electrodes with the redistribution layers formed later, so it is countered by material and process improvements and by position correction during exposure.

• A. Electromigration is the movement of metal atoms in wiring caused by current.
• B. Latch-up is a high-current phenomenon caused by a parasitic thyristor.
• C. Correct. It is chip misalignment during encapsulation.