Advanced packaging (3D and chiplets)
Which pair of typical pitches (terminal spacing) for chip-to-chip connections is most appropriate?
- AMicrobumps about tens of micrometers; hybrid bonding 10 µm or less
- BMicrobumps about several millimeters; hybrid bonding about 1 mm
- CBoth 100 µm or more
Show answer and explanation
Answer: A. Microbumps about tens of micrometers; hybrid bonding 10 µm or less
Microbumps use solder and must avoid shorts from spreading solder, so their pitch is typically tens of micrometers (around 20 µm at the finest). Hybrid bonding, which uses no bumps, can go to 10 µm or below and even a few micrometers, providing orders of magnitude more connections in the same area.
- A. Correct. Hybrid bonding achieves pitches orders of magnitude finer.
- B. Several millimeters is wider than ordinary solder balls.
- C. 100 µm or more is about the spacing of ordinary flip-chip bumps.