What is Overetch?

Continuing to etch for a set time after endpoint so the film is removed everywhere on the wafer. It is done under conditions with high selectivity to the underlying layer.

Field: Etching

Overetch in the explanations

Questions that mention Overetch (6)

  1. After the etch endpoint is detected, what is it called to continue etching for a set time to ensure the film is removed across the whole wafer?
  2. If the oxide etch rate is 100 nm/min and the mask is consumed at 20 nm/min, what is the selectivity to the mask?
  3. In gate etching, what is the phenomenon called in which the pattern sidewall is undercut laterally near the boundary with the underlying insulator?
  4. If etching proceeds at 100 nm/min for 3 minutes, how much film is removed?
  5. In gate electrode etching, what is commonly done to preserve the thin gate insulator underneath?
  6. When a 1 µm film is etched just down to the underlayer by perfectly isotropic wet etching, roughly how much is etched laterally from the mask edge (undercut)?

Related terms

Selectivity Erosion Hard mask Plasma Endpoint detection Wet etching Isotropic etching MEMS ALE (atomic layer etching) Anisotropic etching

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