Packaging and assembly

Which correctly describes wire bonding?

  1. AA method that connects the chip's bond pads to a lead frame or substrate with fine metal wires
  2. BA method that flips the chip and connects it directly to the substrate with bumps
  3. CA method that encapsulates the chip in resin
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Answer: A. A method that connects the chip's bond pads to a lead frame or substrate with fine metal wires

Wire bonding connects the chip's bond pads to the terminals of a lead frame or package substrate with fine wires of gold, copper, aluminum or similar metals. The bonds are made using heat, pressure and ultrasonic energy. It has a long history and is still used in many packages today.

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More Packaging and assembly questions

  1. Which correctly describes flip-chip mounting?
  2. Which correctly describes a feature of BGA (ball grid array) packages?
  3. Which correctly describes dicing?
  4. Which material is mainly used as the encapsulant in typical resin-molded packages?
  5. Which materials are commonly used for lead frames?