Metrology and analysis

Which technology is being researched and introduced to measure shapes such as deep holes three-dimensionally without cutting cross-sections?

  1. AVisual inspection with an optical microscope
  2. BDimension measurement using X-ray scattering (CD-SAXS) and similar methods
  3. CMeasuring wafer weight
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Answer: B. Dimension measurement using X-ray scattering (CD-SAXS) and similar methods

For deep, narrow structures such as 3D NAND memory holes, internal shapes are hard to see with optical metrology or SEMs, and cross-section observation is destructive. Because X-rays penetrate materials easily, methods such as CD-SAXS, which determines the shape of periodic structures from X-ray scattering patterns, are being researched and introduced.

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  1. Which method is used to measure interstitial oxygen concentration in silicon?
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  3. Which function captures SEM images of defects found in inspection and automatically classifies their types from the images?
  4. Which correctly describes the general difference between "metrology" and "inspection" on a semiconductor production line?
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