Metrology and analysis

Which is a typical principle used in defect inspection tools that detect particles and pattern defects on wafers?

  1. ADetecting light scattered when light is shone on the wafer, and comparing images of adjacent dies
  2. BChanges in wafer weight
  3. CThe sound when the wafer is tapped
Show answer and explanation

Answer: A. Detecting light scattered when light is shone on the wafer, and comparing images of adjacent dies

Particles scatter incident light, so they are found by detecting scattered light. Pattern defects are detected by comparing the image with that of a neighboring die with the same pattern and flagging places that differ. Detected defects are then examined in detail with an SEM and classified (review).

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  1. What is mainly measured with an atomic force microscope (AFM)?
  2. What can be determined with EDX (energy-dispersive X-ray spectroscopy), used together with SEM and TEM?
  3. Which method is often used to analyze trace metal contamination on wafer surfaces?
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  5. What is the measurement called that shines light on periodic patterns and compares the spectrum of reflected and diffracted light with a model to determine linewidth and cross-sectional shape?