Interconnect processes

Which technique forms vias self-aligned to wiring trenches to tolerate misalignment between upper and lower wiring layers?

  1. ATSV
  2. BSelf-aligned via
  3. CLDD
Show answer and explanation

Answer: B. Self-aligned via

As wiring pitch narrows, even a slight via misalignment can short to the adjacent wire. In self-aligned vias, via etching is confined to the area of the wiring trench or hard mask, so even with misalignment the via does not connect to the adjacent wire.

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