Interconnect processes

Which metal has been used in many LSIs for the top-level bond pads where wire bonding is done?

  1. ATungsten
  2. BTitanium
  3. CAluminum
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Answer: C. Aluminum

Even after internal wiring switched to copper, aluminum has been widely used for top-level bond pads. Aluminum forms a thin, stable surface oxide that resists corrosion and has a long track record of bonding with gold and copper wire.

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More Interconnect processes questions

  1. What is the method called that fills wiring trenches and vias with copper at the same time and finishes them with a single CMP step?
  2. What is the role of the thin copper film sputtered before filling copper by electroplating?
  3. What problems occur when copper filling is incomplete and a void remains in a via?
  4. If the spacing between adjacent wires in the same layer is halved, approximately how does the capacitance between them change? (Approximate as parallel plates.)
  5. Which technique forms vias self-aligned to wiring trenches to tolerate misalignment between upper and lower wiring layers?