Interconnect processes

What is the film called that is formed on the top of a chip to protect the internal circuits from moisture, contamination and mechanical damage?

  1. AGate oxide
  2. BPassivation film
  3. CBuried oxide
Show answer and explanation

Answer: B. Passivation film

A passivation film covers the chip surface and is made of silicon nitride, oxide and resin films such as polyimide. It protects circuits from moisture and ion ingress and from damage during assembly, improving product reliability. Openings are left only at the bond pads.

Practice this topic Back to topic

More Interconnect processes questions

  1. Which metal has been used in many LSIs for the top-level bond pads where wire bonding is done?
  2. What is the method called that fills wiring trenches and vias with copper at the same time and finishes them with a single CMP step?
  3. What is the role of the thin copper film sputtered before filling copper by electroplating?
  4. What problems occur when copper filling is incomplete and a void remains in a via?
  5. If the spacing between adjacent wires in the same layer is halved, approximately how does the capacitance between them change? (Approximate as parallel plates.)