Interconnect processes

Which is closest to the number of wiring layers in advanced logic LSIs?

  1. A1 layer
  2. B3 layers
  3. C10 or more layers
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Answer: C. 10 or more layers

Advanced logic LSIs have more than ten layers of wiring above the transistors, with fine wiring in the lower layers and thick power and global wiring in the upper layers. The number of steps in the interconnect process (BEOL) rivals that for making the transistors.

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More Interconnect processes questions

  1. What is an advantage of metals such as ruthenium (Ru), being considered as alternatives to copper for fine wiring?
  2. What is the film called that is formed on the top of a chip to protect the internal circuits from moisture, contamination and mechanical damage?
  3. Which metal has been used in many LSIs for the top-level bond pads where wire bonding is done?
  4. What is the method called that fills wiring trenches and vias with copper at the same time and finishes them with a single CMP step?
  5. What is the role of the thin copper film sputtered before filling copper by electroplating?