Interconnect processes

In Black's equation for wire lifetime under electromigration, which factors shorten the lifetime?

  1. AMaking the wire wider
  2. BHigh current density and high temperature
  3. CLowering the temperature
Show answer and explanation

Answer: B. High current density and high temperature

Black's equation states that median time to failure is inversely proportional to current density to the power n and proportional to exp(Ea/kT). The higher the current density and the temperature, the shorter the lifetime. In design, an upper limit on current density is set for each wire.

Practice this topic Back to topic

More Interconnect processes questions

  1. Which is closest to the number of wiring layers in advanced logic LSIs?
  2. What is an advantage of metals such as ruthenium (Ru), being considered as alternatives to copper for fine wiring?
  3. What is the film called that is formed on the top of a chip to protect the internal circuits from moisture, contamination and mechanical damage?
  4. Which metal has been used in many LSIs for the top-level bond pads where wire bonding is done?
  5. What is the method called that fills wiring trenches and vias with copper at the same time and finishes them with a single CMP step?