Advanced transistors (FinFET and GAA)

Which 3D integration method builds transistor layers one after another on the wafer, without bonding chips?

  1. A2.5D integration
  2. BMonolithic 3D integration (sequential 3D integration)
  3. CSiP
Show answer and explanation

Answer: B. Monolithic 3D integration (sequential 3D integration)

In monolithic 3D integration, after the first layer of transistors is built, a new semiconductor layer is formed on top and a second layer of transistors is built in it. Interlayer connections can be much finer than with bonding, but low-temperature processes are needed so that the heat of building the upper layer does not damage the lower one.

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More Advanced transistors (FinFET and GAA) questions

  1. Which company and generation first put FinFETs (called Tri-Gate by Intel) into volume-production logic products?
  2. Which company and generation were first to announce volume production of GAA (nanosheet) transistors?
  3. What is the main purpose of scaling transistors down?
  4. What does "nanosheet" refer to in a nanosheet GAA transistor?
  5. What does the "k" in "high-k gate dielectric" represent?