FinFET vs GAA Transistors: Key Differences
In a FinFET the gate wraps a vertical fin of silicon on three sides. In a gate-all-around (GAA) transistor the gate surrounds the channel on all sides, usually as stacked horizontal nanosheets. Wrapping the channel more completely gives better control of leakage at short gate lengths, which is why leading chipmakers are moving from FinFET to GAA at the 3 nm and 2 nm class.
| Aspect | FinFET | GAA (nanosheet) |
|---|---|---|
| Gate structure | The gate covers three sides of a vertical fin | The gate surrounds the channel on all four sides |
| Channel shape | A thin vertical fin of silicon | Horizontal nanosheets (or nanowires), stacked on top of each other |
| Electrostatic control | Good, much better than planar transistors | Even better, which reduces leakage and supports shorter gates and lower supply voltage |
| Tuning the channel width | In discrete steps: the width comes from the number of fins, because fin height is fixed | Flexible: the sheet width and the number of sheets can be chosen per transistor |
| Main manufacturing steps | Fin patterning (often with SADP or SAQP), fin isolation, gate formation | Epitaxy of alternating Si and SiGe layers, selective removal of SiGe to release the sheets, inner spacers |
| Process complexity | Mature and well understood | More complex, with new steps and tighter control |
| Self-heating | A concern, because heat escapes poorly from the thin channel | A concern as well, since the sheets are surrounded by insulators |
| First volume production | Intel 22 nm (Tri-Gate), shipping in 2012 | First volume production at the 3 nm class, around 2022; other major makers followed |
| Vendor names | Tri-Gate (Intel), FinFET (TSMC, Samsung and others) | RibbonFET (Intel), MBCFET (Samsung), nanosheet (TSMC) |
Figures are typical orders of magnitude and vary by process generation and product.