Deposition (CVD and PVD)

Which deposition method fills very narrow, deep trenches from the bottom with a flowable film and then solidifies it?

  1. AVacuum evaporation
  2. BFlowable CVD (FCVD) or spin-on dielectric (SOD)
  3. CMagnetron sputtering
Show answer and explanation

Answer: B. Flowable CVD (FCVD) or spin-on dielectric (SOD)

Flowable CVD deposits a film that flows like a liquid at low temperature, filling trenches from the bottom, and then solidifies and converts it into oxide in later treatments. Spin-on dielectrics (SOD) also use flowability. They are used to fill trenches such as fine STI where ordinary CVD tends to leave voids.

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More Deposition (CVD and PVD) questions

  1. What is generally done to increase the deposition rate in sputtering?
  2. For films of the same material, in what way are high-temperature thermal CVD films generally better than plasma CVD films?
  3. What is the approximate film thickness deposited in one ALD cycle?
  4. What is an advantage of vacuum evaporation that heats material with an electron beam?
  5. Which technique uses differences in surface materials to grow films only in specific places?