Deposition (CVD and PVD)

Which technique uses differences in surface materials to grow films only in specific places?

  1. ASputtering
  2. BBlanket deposition
  3. CArea-selective deposition
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Answer: C. Area-selective deposition

Area-selective deposition uses differences in how readily the underlying material reacts to deposit films only where needed, for example on metal but not on insulator. It can eliminate lithography and etching steps and has no alignment errors, so it is being researched as a means of further scaling.

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More Deposition (CVD and PVD) questions

  1. What is the most appropriate range for the thickness of thin films handled in semiconductor manufacturing?
  2. Which correctly describes the basic way an LSI is built in manufacturing?
  3. What is the main reason many deposition processes are carried out in vacuum equipment?
  4. Which deposition method has mainly been used to form aluminum wiring films?
  5. What does "sputter yield" mean in sputtering?