Deposition (CVD and PVD)

What problem tends to occur when a deposited thin film has large internal stress?

  1. AWafer bow, and film peeling or cracking
  2. BOnly the film color changes, with no real problem
  3. CThe film's electrical resistance becomes zero
Show answer and explanation

Answer: A. Wafer bow, and film peeling or cracking

Thin films retain tensile or compressive stress depending on deposition conditions and differences in thermal expansion from the substrate. Large stress bows the wafer, throwing exposure out of focus, or causes films to peel or crack. On the other hand, some techniques deliberately use stress to strain the channel.

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More Deposition (CVD and PVD) questions

  1. What is the method called in which liquid material is dropped onto the center of a wafer and spun at high speed to form a uniform film?
  2. Which liquid organosilicon compound is widely used as a source for CVD of silicon oxide?
  3. Which gas is used as the source for tungsten CVD?
  4. Why has high-density plasma CVD (HDP-CVD) been used to fill narrow trenches with insulator?
  5. Which correctly describes uses of silicon nitride (Si3N4) films?