CMP and cleaning

What is an advantage of single-wafer cleaning tools, which process one wafer at a time?

  1. AThey can process large numbers of wafers at once
  2. BThey use no chemicals at all
  3. CCross-contamination between wafers is unlikely, and conditions are easy to control for each wafer
Show answer and explanation

Answer: C. Cross-contamination between wafers is unlikely, and conditions are easy to control for each wafer

Single-wafer cleaning sprays chemicals onto a spinning wafer and processes wafers one at a time, so contamination is unlikely to transfer from other wafers and conditions can be finely controlled. Batch tools that immerse many wafers in chemical tanks have high throughput but risk cross-contamination. Single-wafer cleaning is increasingly used in advanced processes.

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More CMP and cleaning questions

  1. What is the main purpose of using IPA (isopropyl alcohol) when drying wafers after cleaning?
  2. Which method is used to detect the polishing endpoint in CMP?
  3. In Preston's equation for CMP removal rate, which quantity is the removal rate proportional to?
  4. Which abrasive particles are often used in STI CMP to achieve high polishing selectivity of oxide to silicon nitride?
  5. Which cleaning method applies MHz-range ultrasound to the cleaning solution to remove tiny particles from the wafer surface?